High-Density ceramic content:
Céramique uses a high-density layered composite of five unique shapes of thermally
conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to
maximize particle-to-particle contact area and thermal transfer in micro to moderate
bond line situations. This exclusive combination provides performance exceeding most
metal based compounds.
Controlled Triple-Phase Viscosity:
Céramique does not contain any silicone. The suspension
fluid is a proprietary mixture of advanced polysynthetic oils that provide superior
performance and long-term stability. During the system's
initial use, the heat from the CPU lowers the viscosity of the compound to enhance the
filling of the microscopic valleys and ensure a minimum bond line between the heatsink
and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours
of use to its final consistency designed for long-term stability.
(This should not be confused with conventional phase change
pads that are pre-attached to many heatsinks. Those pads melt each time they get hot
then re-solidify when they cool. The viscosity changes that Céramique goes through are
much more subtle and ultimately much more effective.)
Céramique is engineered to not separate, run, migrate, or bleed.
Céramique does not contain any metal or other
electrically conductive materials. It is a pure electrical insulator,
neither electrically conductive nor capacitive.
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